VAPOR PHASE REFLOW PC
VAPOR PHASE REFLOW DOWNLOAD

VAPOR PHASE REFLOW PC

Alternatively, captured data can be transferred by wireless telemetry to any selected PC station, allowing real-time profile viewing and analysis by the user.Ī high temperature must be reached so that soldering can be accomplished even on sockets or large BGAs, but at the same time needs to be checked for overheating or delamination.

VAPOR PHASE REFLOW DOWNLOAD

Once retrieved from the process, the hot shield can be opened allowing data download and rapid air cooling, minimising the potential for instrument damage. A two-piece, low mass heat-shield gives protection whilst minimising process impact, allowing operation across pre-heat, vapour and vacuum stages. SolderStar developed a solution that gave users the ability to understand and control the production process. Yet PCB designers do not always adhere to machine manufactures recommendations so they then need to be set-up by an engineer and monitored if long term quality is to be maintained. ‘Tomb-stoning’ is an evident problem given the even heating of the vapour phase process this is unexpected. The original ‘dream’ sold by the manufacturers was that profiling was not needed the reality is ‘you can't manage what you don't measure’. The latest evolution of these machines offer user controlled soldering, with freely adjustable temperature gradients and profiles. To combat these process challenges, SolderStar developed a new profiling system designed specifically for vapour phase machines. Due to this, vapour phase soldering was reduced to special applications with high mass or complex boards in low numbers. However there were some disadvantages, fast temperature rise and little influence on the temperature profiles. It offers continuous heating-up of the complete assembly, an oxygen free soldering process without the use of any protective gas and finally the efficient use of energy because of the high heat transfer, therefore reducing operating costs. Another advantage includes no overheating of assemblies, so vapour phase soldering is ideal for lead free solder processes.

This phase change, known as condensation, on the surface of the solder piece lasts until the assembly has reached the temperature of the vapour. It emits thermal energy by phase change of the heat transfer medium from gas-like to liquid state. It has the advantage that it can heat large masses evenly and quickly whilst the peak temperature is controlled. The process is widely used for assemblies with a large variable of thermal mass components on the PCB. In the beginning of SMT, vapour phase soldering was the preferred reflow soldering technology because of its excellent heat transfer capabilities.

Vapor phase reflow